Williams Plating Company has more than three decades of experience dealing in gold plated engineering solutions for our customers’ needs.

Gold is a highly corrosion resistant finish and has many applications in the electronics industry for solderability, durability, and steady contact resistance over time compared to other finishes less resistant to oxidation.

We can also offer electrolytic nickel, electroless nickel, and copper undercoats depending on our customers’ requirements. These undercoats can improve the final layer of gold’s appearance in addition to assisting with corrosion resistance and level the substrate material in preparation for gold plating. A nickel underplate is also important for copper parts that will be subject to high temperatures serving as a diffusion barrier and preventing intermetallics from weakening the desired characteristics of the gold plating.

We offer rack and barrel plating, have extensive experience in small volume orders, and specialize in complex or unusual gold plating processes tailored to our customer’s specific needs.

WPC sources only Conflict Free gold from smelters certified by the Responsible Minerals Initiative (RMI). Our completed Conflict Minerals Reporting Template and any additional quality information can be found on our Quality Controls page, or can be directly downloaded here.